Nexstrom Targets Fab Integration for 2D Semiconductors

Singapore-based startup Nexstrom is attempting to bridge the gap between laboratory-scale 2D materials and commercial semiconductor fabrication. As reported by TechCrunch, the company is developing a product called North Star designed to grow transition-metal dichalcogenides (TMDs)—materials only a few atomic layers thick—directly on the 300mm (12-inch) wafers used in industry standard chipmaking.

While industry giants including Intel, TSMC, and Belgium's IMEC are exploring 2D material integration, Nexstrom is specifically targeting the difficulty of producing these materials at scale. Co-founder and chief scientist Lance Li, a former TSMC research lead for post-silicon electronics, noted to TechCrunch that while high-quality materials can be produced in labs, they are typically only created on a very small scale.

Nexstrom CEO Phoebe Tan told TechCrunch that the company has already demonstrated material results on 12-inch wafers and is scaling its processes, with plans to complete an 8-inch system by the end of October. The company intends to partner with or sell its technology to major foundries such as Samsung, Intel, and TSMC, rather than competing with them. According to TechCrunch, unnamed industry companies are currently testing Nexstrom's materials and wafers.

To fund this development, Nexstrom recently raised a $12 million seed round from SEEDS, Foothill Ventures, and Xora—the firm that incubated the startup. This brings the company's total funding to $15 million. The capital will be used to expand the team, improve measurement and process control, and support customer qualification programs. The company anticipates its equipment will be ready for commercial production from 2030 to 2035.